ISO/IEC INTERNATIONAL STANDARD 14776-113 First edition 2002-08 Information technology Small computer system interface (scsl) Part 113: Parallel Interface-3 (SPl-3) IEC ISO Reference number ISO/IEC 14776-113:2002(E) HS unde Not for Resale The following tradenames have been used in ISO/lEC 14776-113. Verilog? is the tradename of a product supplied by IEEE IEEE Intellectual Property Right Office 445 Hoes Lane P.O, Box 1331 Piscataway, NJ 08855 This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of this product. Equivalent descriptions may be used if they can be shown to lead to the same results. Teflon? is the tradename of a product supplied by E.I. DuPont de Nemours and Company 1007 Market Street Wilmington, DE 19898 This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of this product. Equivalent descriptions may be used if theycanbeshowntoleadtothesameresults ed without license from IHS Not for Resale ISO/IEC INTERNATIONAL STANDARD 14776-113 First edition 2002-08 Information technology - Small computer system interface (scsl) Part 113: Parallel Interface-3 (SPl-3) @IS0/IEC2002 All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any ISO/IEC Copyright Office · Case postale 56 · CH-1211 Geneve 20 · Switzerland JEC PRICE CODE XF ISO For price, see current catalogue THS under Not for Resale 14776-113 @ ISO/IEC:2002(E) - 2 - CONTENTS FOREWORD .17 INTRODUCTION.. ..18 1 Scope. 2 Normative references ...... 2.1 Normative references .... .20 2.2 2.3 References under development 2.4 Other references...... 3 Definitions, symbols, abbreviations, and conventions . ..21 3.1 Definitions .21 3.2 Symbols and abbreviations... 3.3 Keywords..... ...31 3.4 Conventions .. ...32 3.5 Notation for Procedures and Functions .. .33 4 General. .34 4.1 General overview.. ..34 4.2 Cables, Connectors, Signals, Transceivers. .34 4.3 Physical architecture of bus .. .34 4.4 Physical topology details and definitions. 35 4.5 Bus loading...... .37 4.6 Termination requirements ..... 4.7 Scsl device Addressing ........ 4.8 Data transfers.. 4.9 Data transfer modes .. ...40 4.9.1 Data transfer modes overview. ..40 4.9.2 ST DATA phase parallel transfers .... ..40 4.9.3 DT DATA phase parallel transfers .... .40 4.9.3.1 DT DATA phase parallel transfers format . 4.9.3.2 Data group transfers ... 4.9.3.3 Information unit transfers . .40 4.10 Protocol.... .40 5 Scsl parallel interface connectors. 44 5.1 Scsl parallel interface connectors overview .... .44 5.2 Nonshielded connector .... 5.2.1 Nonshieldedconnectoralternative1-Acable.. .44 5.2.2 Nonshielded connector alternative 2 - A cable ... ..44 5.2.3 Nonshielded connector alternative 3 - P cable ... .44 5.2.4 Nonshielded connector alternative 4... .45 5.3 Shielded connector..... 5.3.1 Shielded connector overview.... 5.3.2 Shielded connector alternative 1 - A cable.. ..51 5.3.3 Shielded connector alternative 2 - A cable.. .51 5.3.4 Shielded connector alternative 3 - P cable.. .51 5.3.5 Shielded connector alternative 4 - P cable... .51 Copyright IntenationalOrganizationfor Standardization Not for Resale 14776-113 @ ISO/IEC:2002(E) - 3 - 5.4 Connector contact assignments . .59 5.4.1 Connector contact assignments overview.. .59 5.4.2 ..60 5.4.3 Differential connector contact assignments 6 .....66 6.1 Scsl bus interconnect overview ... ..66 6.2 Scsi bus cables ..... 6.3 Interconnect characteristics for signals ......... 6.3.1 Applicability of requirements for Scsl cable media... ...67 6.3.2 Minimum conductor size for signals.. 6.3.3 Local transmission line impedance .. ..67 6.3.4 Extended distance transmission line impedance... ..68 6.3.5 Capacitance ... .68 6.3.6 SE propagation time and propagation time skew.. .....68 6.3.7 Differential propagation time and propagation time skew...... 6.3.8 6.3.9 Differential attenuation ... 6